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Flash

  • Single Power Supply Operation
  • Cost Effective Sector/Block Architecture
  • Low standby current 1uA (Typ)
  • Serial Peripheral Interface (SPI) Compatible
  • Page Program (up to 256 Bytes) Operation
  • Sector, Block or Chip Erase Operation
  • Low Power Consumption
  • Hardware/Software Write Protection
  • Industry Standard Pin-out and Packages
  • Superior Endurance: Min 20 years after 100K cycles





Serial NOR Flash (QSPI, SPI)

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status Models Alt. Version/Doc
512K IS25LQ512B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IBIS/Verilog IS25CD512
1M IS25LP010E Multi I/O Quad SPI 2.3-3.6V 50M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IBIS/Verilog IS25LQ010B
2M IS25LP020E Multi I/O Quad SPI 2.3-3.6V 50M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IBIS/Verilog IS25LQ020B
  IS25WP020E Multi I/O Quad SPI 1.70-1.95V 50M/104Mhz -40 to 125°C SOIC,USON Prod IBIS/Verilog IS25WD020, IS25WQ020
  IS25WP020D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON Prod IBIS/Verilog
4M IS25LP040E Multi I/O Quad SPI 2.3-3.6V 50M/104Mhz -40 to 125°C SOIC,WSON,VVSOP,USON Prod IBIS/Verilog IS25LQ040B
  IS25WP040E Multi I/O Quad SPI 1.70-1.95V 50M/104Mhz -40 to 125°C SOIC,WSON,USON Prod IBIS/Verilog IS25WD040, IS25WQ040
  IS25WP040D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON Prod IBIS/Verilog
8M IS25WP080D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON Prod IBIS/Verilog IS25WP080
  IS25LP080D Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON Prod IBIS/Verilog IS25LQ080B
16M IS25LP016D Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON,TFBGA Prod IBIS/Verilog IS25LQ016B
  IS25WP016D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON,TFBGA Prod IBIS/Verilog IS25WP016
  IS25WJ016F Multi I/O SPI, QPI, DTR 1.65-2.0V 66M/133Mhz -40 to 105°C SOIC,USON Prod IBIS/Verilog
32M IS25LP032D Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,WSON,USON,XSON,TFBGA Prod IBIS/Verilog IS25LQ032B
  IS25WP032D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,WSON,USON,XSON,TFBGA Prod IBIS/Verilog IS25WP032,
IS25WP032A
  IS25WJ032F Multi I/O SPI, QPI, DTR 1.65-2.0V 66M/133Mhz -40 to 105°C SOIC,USON,XSON Prod IBIS/Verilog
64M IS25LP064D Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC,WSON,USON,XSON,TFBGA Prod IBIS/Verilog IS25LP064A
  IS25WP064D Multi I/O SPI, QPI, DTR 1.65-1.95V 80M/166Mhz -40 to 125°C SOIC,WSON,USON,XSON,TFBGA Prod IBIS/Verilog IS25WP064A
  IS25WJ064F Multi I/O SPI, QPI, DTR 1.65-2.0V 66M/133Mhz -40 to 105°C SOIC,WSON,USON,XSON Prod IBIS/Verilog
128M IS25LP128F Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA Prod IBIS/Verilog IS25LP128
  IS25WP128F Multi I/O SPI, QPI, DTR 1.65-1.95V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA Prod IBIS/Verilog IS25WP128
  IS25WJ128F Multi I/O SPI, QPI, DTR 1.65-2.0V 80M/166Mhz -40 to 105°C SOIC,WSON,USON,XSON,TFBGA Prod IBIS/Verilog
256M IS25LP256D Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA Prod IBIS/Verilog IS25LP256E, IS25LP256H
  IS25WP256D Multi I/O SPI, QPI, DTR 1.7-1.95V 80M/133Mhz -40 to 125°C SOIC,WSON,TFBGA Prod IBIS/Verilog IS25WP256E
512M IS25LP512M Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,WSON,TFBGA Prod IBIS/Verilog IS25LP512MG, IS25LP512MH
  IS25WP512M Multi I/O SPI, QPI, DTR 1.7-1.95V 50M/112Mhz -40 to 125°C SOIC,WSON,TFBGA Prod IBIS/Verilog IS25WP512MG
1G IS25LP01G Multi I/O SPI, QPI, DTR 2.7-3.6V 50M/133Mhz -40 to 125°C LFBGA Prod IBIS/Verilog IS25LP01GG
  IS25WP01G Multi I/O SPI, QPI, DTR 1.7-1.95V 50M/104Mhz -40 to 125°C LFBGA Prod IBIS/Verilog IS25WP01GG
2G IS25LP02GG Multi I/O SPI, QPI, DTR 2.7-3.6V 50M/133Mhz -40 to 105°C LFBGA S=NOW
  IS25WP02GG Multi I/O SPI, QPI, DTR 1.65- 1.95V 50M/133Mhz -40 to 105°C LFBGA S=2H/23


Serial NOR Flash with ECC

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status Alt. Version/Doc
128M IS25LE128E Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA Contact Factory  
  IS25WE128E Multi I/O SPI, QPI, DTR 1.7-1.95V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA Contact Factory  
256M IS25LE256E Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA Prod  
  IS25WE256E Multi I/O SPI, QPI, DTR 1.7-1.95V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA Prod  
512M IS25LE512M Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,WSON,TFBGA Prod  
  IS25WE512M Multi I/O SPI, QPI, DTR 1.7-1.95V 50M/112Mhz -40 to 125°C SOIC,WSON,TFBGA Prod  
1G IS25LE01G Multi I/O SPI, QPI, DTR 2.7-3.6V 50M/133Mhz -40 to 125°C LFBGA Prod  
  IS25WE01G Multi I/O SPI, QPI, DTR 1.7-1.95V 50M/104Mhz -40 to 125°C LFBGA Prod  
2G IS25LE02GG Multi I/O SPI, QPI, DTR 2.7-3.6V 50M/133Mhz -40 to 105°C LFBGA S=NOW
  IS25WE02GG Multi I/O SPI, QPI, DTR 1.65- 1.95V 50M/133Mhz -40 to 105°C LFBGA S=2H/23

Security Flash

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status Alt. Version/Doc
128M IS25RLP128F Multi I/O SPI, QPI, DTR, RPMC 2.3-3.6V 80M/166Mhz -40 to 85°C WSON Contact Factory  
256M IS25RLP256E Multi I/O SPI, QPI, DTR, RPMC 2.3-3.6V 80M/166Mhz -40 to 85°C WSON Contact Factory  

Octal Flash (xSPI)

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status Comment/Eval Board
64M IS25LX064 xSPI 2.7-3.6V 133Mhz -40 to 125°C TFBGA Prod Eval Board
  IS25WX064 xSPI 1.7-2.0V 200Mhz -40 to 125°C TFBGA Prod Eval Board
128M IS25LX128 xSPI 2.7-3.6V 133Mhz -40 to 125°C TFBGA Prod Eval Board
  IS25WX128 xSPI 1.7-2.0V 200Mhz -40 to 125°C TFBGA Prod Eval Board
256M IS25LX256 xSPI 2.7-3.6V 133Mhz -40 to 125°C TFBGA Prod Eval Board
  IS25WX256 xSPI 1.7-2.0V 200Mhz -40 to 125°C TFBGA Prod Eval Board
512M IS25LX512M xSPI 2.7-3.6V 133Mhz -40 to 125°C TFBGA Prod Eval Board
  IS25WX512M xSPI 1.7-2.0V 200Mhz -40 to 125°C TFBGA Prod Eval Board
1G IS25LX01G xSPI 2.7-3.6V 133Mhz -40 to 125°C TFBGA S=2H/23 Eval Board
  IS25WX01G xSPI 1.7-2.0V 200Mhz -40 to 125°C TFBGA S=2H/23 Eval Board
2G IS25LX02GA xSPI 2.7-3.6V 133Mhz -40 to 125°C TFBGA Contact Factory Eval Board
  IS25WX02GA xSPI 1.7-2.0V 200Mhz -40 to 125°C TFBGA Contact Factory Eval Board

Twin Quad Serial NOR Flash (x8 SPI)

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status Comment
256M IS25DLP256M Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC,TFBGA Contact Factory  
  IS25DWP256M Multi I/O SPI, QPI, DTR 1.65-1.95V 80M/166Mhz -40 to 125°C SOIC,TFBGA Contact Factory  
512M IS25DLP512M Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC,TFBGA Prod  
  IS25DWP512M Multi I/O SPI, QPI, DTR 1.65-1.95V 80M/166Mhz -40 to 125°C SOIC ,TFBGA Contact Factory  

HyperFlash™

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status Comment
128/256Mb IS26KS/KL Family HyperFlash™ - - - - Contact Factory

Parallel (ISA) NOR Flash

Den Part Number Buy Type Remark Vcc Access Time Temp.Range Package Type Status
32M IS29GL032 x8/x16 Top Boot (U) or Bottom Boot (D)
High Protection (T) or Low Protection (B) 		2.7-3.6V 70ns -40 to 125°C TSOP,BGA Prod
64M IS29GL064 x8/x16 Top Boot (U) or Bottom Boot (D)
High Protection (T) or Low Protection (B) 		2.7-3.6V 70ns -40 to 125°C TSOP,BGA Prod
128M IS29GL128 x8/x16 High Protection (T) or Low Protection (B) 2.7-3.6V 70ns -40 to 125°C TSOP,BGA Prod
256M IS29GL256 x8/x16 High Protection (T) or Low Protection (B) 2.7-3.6V 70ns -40 to 125°C TSOP,BGA Prod

SPI NAND Flash

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status
1G IS37SML01G1 x1, x2, x4 3.3V 104Mhz -40 to 105°C 16-SOIC, 8-WSON Prod
1G IS37SML01G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
1G IS37SMW01G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
2G IS37SML02G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=1H/24
2G IS37SMW02G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=1H/24
4G IS37SML04G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
4G IS37SMW04G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
8G IS37SML08G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
8G IS37SMW08G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24

Automotive SPI NAND Flash

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status
1G IS38SML01G1 x1, x2, x4 3.3V 104Mhz -40 to 105°C 16-SOIC, 8-WSON Prod
1G IS38SML01G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
1G IS38SMW01G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
2G IS38SML02G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=1H/24
2G IS38SMW02G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=1H/24
4G IS38SML04G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
4G IS38SMW04G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
8G IS38SML08G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
8G IS38SMW08G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24

NAND Flash

Den Part Number Buy Vcc Ecc Requirement Bus Width Sequential Read Speed (ns) Temp.Range Package Type Status
1G IS34ML01G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS34ML01G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS34MW01G084 1.8V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS34MW01G164 1.8V 4-bit X16 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS34ML02G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS34ML02G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS34MW02G084 1.8V 4-bit X8 45 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS34MW02G164 1.8V 4-bit X16 45 -40°C to 105°C 48-TSOP, 63-BGA Prod
4G IS34ML04G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP Prod
4G IS34ML04G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP Prod
4G IS34MW04G084 1.8V 4-bit X8 45 -40°C to 105°C 48-TSOP Prod
4G IS34MW04G164 1.8V 4-bit X16 45 -40°C to 105°C 48-TSOP Prod
4G IS34ML04G088/168 3.3V 8-bit X8 or X16 25 -40°C to 85°C 48-TSOP,63-BGA Prod
4G IS34MW04G088/168 1.8V 8-bit X8 or X16 25 -40°C to 85°C 48-TSOP, 63-BGA Prod
8G IS34ML08G088/168 3.3V 8-bit X8 or X16 25 -40°C to 85°C 48-TSOP, 63-BGA Prod
8G IS34MW08G088/168 1.8V 8-bit X8 or X16 25 -40°C to 85°C 48-TSOP, 63-BGA Prod

Automotive NAND

Den Part Number Buy Vcc Ecc Requirement Bus Width Sequential Read Speed (ns) Temp.Range Package Type Status
1G IS35ML01G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS35ML01G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS35MW01G084 1.8V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS35MW01G164 1.8V 4-bit X16 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS35ML02G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS35ML02G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS35MW02G084 1.8V 4-bit X8 45 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS35MW02G164 1.8V 4-bit X16 45 -40°C to 105°C 48-TSOP, 63-BGA Prod
4G IS35ML04G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP Prod
4G IS35ML04G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP Prod
4G IS35MW04G084 1.8V 4-bit X8 45 -40°C to 105°C 48-TSOP Prod
4G IS35MW04G164 1.8V 4-bit X16 45 -40°C to 105°C 48-TSOP Call Factory for Samples

eMMC

Den Part Number Buy Bus Width Temperature Package Type MMC Interface Status Alt. Version/Doc
8GB IS21EF08G x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.1 Sampling IS21ES08G,
IS21ES08GA
16GB IS21EF16G x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.1 Sampling IS21ES16G,
IS21TF16G
32GB IS21TF32G x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.1 Prod IS21ES32G
64GB IS21TF64G x8 -40°C ~ 85°C 100 FBGA,153 FBGA 5.1 Prod IS21ES64G
128GB IS21TF128G x8 -40°C ~ 85°C 100 FBGA,153 FBGA 5.1 Prod

Automotive eMMC

Den Part Number Buy Bus Width Temperature Package Type MMC Interface Status Alt. Version/Doc
8GB IS22EF08G x8 -40°C ~ 105°C 100 FBGA, 153 FBGA 5.1 Sampling IS22ES08G,
IS22TF08G
16GB IS22EF16G x8 -40°C ~ 105°C 100 FBGA, 153 FBGA 5.1 Sampling IS22ES16G,
IS22TF16G
32GB IS22TF32G x8 -40°C ~ 105°C 100 FBGA, 153 FBGA 5.1 Prod IS22ES32G
64GB IS22TF64G x8 -40°C ~ 105°C 100 FBGA,153 FBGA 5.1 Prod IS22ES64G
128GB IS22TF128G x8 -40°C ~ 105°C 100 FBGA,153 FBGA 5.1 Prod

UFS 2.1

Den Part Number Buy VCC/VCCQ Temperature Package Type UFS Interface Status Alt. Version/Doc
64GB IS27TH064G21 3.3V/1.8V -40°C ~ 105°C 153 FBGA UFS 2.1 Sampling
128GB IS27TH128G21 3.3V/1.8V -40°C ~ 105°C 153 FBGA UFS 2.1 Sampling
256GB IS27TH256G21 3.3V/1.8V -40°C ~ 105°C 153 FBGA UFS 2.1 Sampling

UFS 3.1

Den Part Number Buy VCC/VCCQ Temperature Package Type UFS Interface Status Alt. Version/Doc
64GB IS27TH064G31 2.5V/1.2V -40°C ~ 105°C 153 FBGA UFS 3.1 S=Q1/24
128GB IS27TH128G31 2.5V/1.2V -40°C ~ 105°C 153 FBGA UFS 3.1 S=Q1/24
256GB IS27TH256G31 2.5V/1.2V -40°C ~ 105°C 153 FBGA UFS 3.1 S=Q1/24

Flash Application Notes

App Note Description Comment
AN25D014 Write Operation Flow for Quad SPI NOR Contact ISSI
AN29D012 Understanding and Interpreting read timing of parallel NOR FLASH Contact ISSI
AN25D011 Thin USON/WSON/XSON package handling Contact ISSI
AN25G001 Serial Peripheral Interface (SPI) Flash Layout Guide Contact ISSI
AN25G004 ISSI SPI NOR connection to Xilinx Artix-7 FPGA Contact ISSI
AN25G005 How to program ISSI flash using Xilinx iMPACT tool Contact ISSI
AN25R001 How to replace Altera EPCS/EPCQ/EPCQ-L SPI Contact ISSI
AN25R002 XIP mode conversion to ISSI SPI NOR Contact ISSI

Notes:

  • Contact ISSI to request SFDP table.
  • Simulation Models not listed above may be available upon request
  • S = Sample, Prod = Production
  • NR = Not Recommended for new designs
  • EOL = End of Life
  • IF YOU DON'T SEE A PRODUCT YOU ARE INTERESTED IN AND HAVE A SPECIAL REQUEST, CONTACT US AND LET US KNOW
  • Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
  • a. the risk of injury or damage has been minimized;
  • b. the user assume all such risks; and
  • c. potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances