MCP - Integrated Silicon Solution Inc.
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Octal MCP

  • MCP solutions implement both Octal (xSPI) Flash and Octal RAM devices
  • Combined devices share a single xSPI bus
  • Space saving 24-BGA package

Octal MCP

Part Number Description Vcc Frequency (Mhz) Temp. Range Pkg(Pins) Status Comment
IS72WVO16M8AWO256-200HLA2 1.8V 128Mb OctalRAM + 1.8V 256Mb xSPI Flash 1.7-1.95V 200 -40 to 105°C 24-TFBGA Sampling  
IS72WVO16M8AWO256-166HLA3 1.8V 128Mb OctalRAM + 1.8V 256Mb xSPI Flash 1.7-1.95V 166 -40 to 125°C 24-TFBGA Sampling  
IS72WVO16M8AWO512-166HLA3 1.8V 128Mb OctalRAM + 1.8V 512Mb xSPI Flash 1.7-1.95V 166 -40 to 125°C 24-TFBGA Sampling  
IS72WVO32M8AWO256-200HLA2 1.8V 256Mb OctalRAM + 1.8V 256Mb xSPI Flash 1.7-1.95V 200 -40 to 105°C 24-TFBGA Sampling  
IS72WVO32M8AWO512-200HLA2 1.8V 256Mb OctalRAM + 1.8V 512Mb xSPI Flash 1.7-1.95V 200 -40 to 105°C 24-TFBGA Sampling  
IS72WVO16M8BLO256-133HLA2 3.0V 128Mb OctalRAM + 3.0V 256Mb xSPI Flash 2.7-3.6V 133 -40 to 105°C 24-TFBGA Sampling  
IS72WVO16M8BLO256-133HLA3 3.0V 128Mb OctalRAM + 3.0V 256Mb xSPI Flash 2.7-3.6V 133 -40 to 125°C 24-TFBGA Sampling  
IS72WVO16M8BLO512-133HLA3 3.0V 128Mb OctalRAM + 3.0V 512Mb xSPI Flash 2.7-3.6V 133 -40 to 125°C 24-TFBGA Sampling  
IS72WVO32M8BLO256-133HLA2 3.0V 256Mb OctalRAM + 3.0V 256Mb xSPI Flash 2.7-3.6V 133 -40 to 105°C 24-TFBGA Sampling  
IS72WVO16M8BLO512-133HLA2 3.0V 256Mb OctalRAM + 3.0V 512Mb xSPI Flash 2.7-3.6V 133 -40 to 105°C 24-TFBGA Sampling  

Notes:

  • Simulation Models not listed above may be available upon request
  • S = Sample, Prod = Production
  • NR = Not Recommended for new designs
  • EOL = End of Life
  • IF YOU DON'T SEE A PRODUCT YOU ARE INTERESTED IN AND HAVE A SPECIAL REQUEST, CONTACT US AND LET US KNOW
  • Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
  • a. the risk of injury or damage has been minimized;
  • b. the user assume all such risks; and
  • c. potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances