DRAM Flash Asynchronous SRAM Low-Pin Count SRAM and PSRAM Synchronous SRAM QUAD(P) DDR-II(P) Density Product Type Voltage Package Type Temperature Grade(Details) 256Kb 512Kb 1Mb 2Mb 4Mb 8Mb 16Mb 32Mb 64Mb 128Mb 256Mb 512Mb 1Gb 2Gb 4Gb 8Gb 16Gb 32Gb 64Gb eMMC Multi I/O Quad SPI Multi I/O SPI, QPI, DTR Multi I/O SPI, QPI, DTR, RPMC NAND Octal MCP Parallel NOR SPI NAND SPI, QSPI SPI, QSPI, QPI, DTR Twin SPI UFS2.1 UFS3.1 xSPI (Octal) 1.8V 2.5V/1.2V 3.0V 3.3V 3.3V/1.8V 3V 48-TSOP (63-BGA) BGA BGA24(6x8mm) FBGA100 FBGA153 KGD LFBGA SOIC SOP16(300mil) TFBGA TSOP TSSOP USON VVSOP WSON WSON(6x8mm) XSON -40 to 105°C (Extended) -40 to 125°C (Automotive A3) -40 to 105°C (Automotive A2) -40 to 105°C (Industrial) -40 to 85°C (Automotive A1) -40 to 125°C (Extended) -40 to 85°C (Industrial) Loading......
Notes: Simulation Models not listed above may be available upon request S = Sample, Prod = Production NR = Not Recommended for new designs EOL = End of Life IF YOU DON'T SEE A PRODUCT YOU ARE INTERESTED IN AND HAVE A SPECIAL REQUEST, CONTACT US AND LET US KNOW Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a. the risk of injury or damage has been minimized; b. the user assume all such risks; and c. potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances