Integrated Silicon Solution Inc. SRAM, DRAM, FLASH, ANALOG, KGD, WAFER
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Flash

  • Single Power Supply Operation
  • Cost Effective Sector/Block Architecture
  • Low standby current 1uA (Typ)
  • Serial Peripheral Interface (SPI) Compatible
  • Page Program (up to 256 Bytes) Operation
  • Sector, Block or Chip Erase Operation
  • Low Power Consumption
  • Hardware/Software Write Protection
  • Industry Standard Pin-out and Packages
  • Superior Endurance: Min 20 years after 100K cycles

Serial NOR Flash (QSPI, SPI)

Den Part Number Type Vcc Frequency Temp.Range Package Type Status Prev. Version/Doc
256K IS25LQ025B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IS25CD025
512K IS25LQ512B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IS25CD512
1M IS25LQ010B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IS25CD010
2M IS25LQ020B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IS25LD020
  IS25WQ020 Multi I/O Quad SPI 1.65-1.95V 33M/104Mhz -40 to 125°C SOIC,WSON,VVSOP, USON Prod IS25WD020
  IS25WP020D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON S=NOW IS25WP020
4M IS25LQ040B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,WSON,VVSOP,USON Prod IS25LD040
  IS25WQ040 Multi I/O Quad SPI 1.65-1.95V 33M/104Mhz -40 to 125°C SOIC,WSON,VVSOP Prod IS25WD040
  IS25WP040D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON S=NOW IS25WP040
8M IS25WP080D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON Prod IS25WP080
  IS25LP080D Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON Prod IS25LQ080/IS25LQ080B
16M IS25LP016D Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON,TFBGA Prod IS25LQ016B
  IS25WP016D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON,TFBGA Prod IS25WP016
32M IS25LP032D Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,WSON,USON,TFBGA Prod IS25CQ032, IS25LQ032B
  IS25WP032D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,WSON,USON,TFBGA Prod IS25WP032, IS25WP032A
64M IS25LP064A Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA Prod IS25LP064
Application Note
  IS25WP064A Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA Prod IS25WP064
128M IS25LP128 Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA Prod Application Note 
  IS25WP128 Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA Prod
256M IS25LP256D Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA Prod
  IS25WP256D Multi I/O SPI, QPI, DTR 1.65-1.95V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA Prod

Twin Serial NOR Flash (SPI)

Den Part Number Type Vcc Frequency Temp.Range Package Type Status Comment
512M IS25DLP512M Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC ,TFBGA S=NOW  
  IS25DWP512M Multi I/O SPI, QPI, DTR 1.65-1.95V 80M/166Mhz -40 to 125°C SOIC ,TFBGA S=Q3/17  

HyperFlash™

Den Part Number Type Vcc Access Time Temp.Range Package Type Status Comment
128Mb IS26KL128S HyperFlash™ 2.3-3.6V 100 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) Prod  
  IS26KS128S HyperFlash™ 1.7-1.95V 166 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) Prod  
256Mb IS26KL256S HyperFlash™ 2.3-3.6V 100 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) Prod  
  IS26KS256S HyperFlash™ 1.7-1.95V 166 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) Prod  
512Mb IS26KL512S HyperFlash™ 2.3-3.6V 100 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) Prod  
  IS26KS512S HyperFlash™ 1.7-1.95V 166 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) Prod  

Parallel NOR Flash ISA Flash

Den Part Number Type Remark Vcc Access Time Temp.Range Package Type Status
128M IS29GL128 x8/x16 High or Low 2.7-3.6V 70ns -40 to 125°C TSOP,BGA S=Q2/18
256M IS29GL256 x8/x16 High or Low 2.7-3.6V 70ns -40 to 125°C TSOP,BGA S=Q1/18

SPI NAND Flash

Den Part Number Type Vcc Frequency Temp.Range Package Type Status
1G IS37SML01G1 x1, x2, x4 3.3V 104Mhz -40 to 105°C 16-SOIC, 8-WSON S=NOW

Automotive SPI NAND Flash

Den Part Number Type Vcc Frequency Temp.Range Package Type Status
1G IS38SML01G1 x1, x2, x4 3.3V 104Mhz -40 to 105°C 16-SOIC, 8-WSON S=NOW

NAND Flash

Den Part Number Vcc Ecc Requirement Bus Width Sequential Read Speed (ns) Temp.Range Package Type Status
1G IS34ML01G081 3.3V 1-bit X8 25 -40°C~85°C 48-TSOP, 63-BGA S=NOW
1G IS34ML01G084 3.3V 4-bit X8 25 -40°C~85°C 48-TSOP, 63-BGA S=NOW
1G IS34MW01G084 1.8V 4-bit X8 25 -40°C~85°C 48-TSOP, 63-BGA Contact Factory for samples
1G IS34MW01G164 1.8V 4-bit X16 25 -40°C~85°C 63-BGA Contact Factory for samples
2G IS34ML02G081 3.3V 1-bit X8 25 -40°C~85°C 48-TSOP1 S=Q1/18
2G IS34ML02G084 3.3V 4-bit X8 25 -40°C~85°C 48-TSOP1 S=Q1/18
2G IS34MW02G084 1.8V 4-bit X8 45 -40°C~85°C 48-TSOP1 S=Q1/18
2G IS34MW02G164 1.8V 4-bit X16 45 -40°C~85°C 48-TSOP1 S=Q1/18
4G IS34ML04G081 3.3V 1-bit X8 25 -40°C~85°C 48-TSOP Prod
4G IS34ML04G084 3.3V 4-bit X8 25 -40°C~85°C 48-TSOP Prod
4G IS34MW04G084 1.8V 4-bit X8 45 -40°C~85°C 48-TSOP Prod
4G IS34MW04G164 1.8V 4-bit X16 45 -40°C~85°C 48-TSOP Contact Factory for samples

Automotive NAND

Den Part Number Vcc Ecc Requirement Bus Width Sequential Read Speed (ns) Temp.Range Package Type Status
1G IS35ML01G081 3.3V 1-bit X8 25 -40°C~85°C 48-TSOP, 63-BGA S=NOW
1G IS35ML01G084 3.3V 4-bit X8 25 -40°C~85°C 48-TSOP, 63-BGA S=NOW
1G IS35MW01G084 1.8V 4-bit X8 25 -40°C~85°C 48-TSOP, 63-BGA Contact Factory for samples
1G IS35MW01G164 1.8V 4-bit X16 25 -40°C~85°C 63-BGA Contact Factory for samples
2G IS35ML02G081 3.3V 1-bit X8 25 -40°C~85°C 48-TSOP1 S=Q1/18
2G IS35ML02G084 3.3V 4-bit X8 25 -40°C~85°C 48-TSOP1 S=Q1/18
2G IS35MW02G084 1.8V 4-bit X8 45 -40°C~85°C 48-TSOP1 S=Q1/18
2G IS35MW02G164 1.8V 4-bit X16 45 -40°C~85°C 48-TSOP1 S=Q1/18
4G IS35ML04G081 3.3V 1-bit X8 25 -40°C~85°C 48-TSOP Prod
4G IS35ML04G084 3.3V 4-bit X8 25 -40°C~85°C 48-TSOP Prod
4G IS35MW04G084 1.8V 4-bit X8 45 -40°C~85°C 48-TSOP Prod
4G IS35MW04G164 1.8V 4-bit X16 45 -40°C~85°C 48-TSOP Contact Factory for samples

eMMC

Den Part Number NAND Flash Voltage Bus Width Temperature Package Type MMC Interface Status
4GB IS21ES04G 32Gbx1 3.3V x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17
8GB IS21ES08G 64Gbx1 3.3V x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17
16GB IS21ES16G 128Gbx1 3.3V x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17
32GB IS21ES32G 128Gbx2 3.3V x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17
64GB IS21ES64G 128Gbx4 3.3V x8 -40°C ~ 85°C 100 FBGA,153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17

Automotive eMMC

Den Part Number NAND Flash Voltage Bus Width Temperature Package Type MMC Interface Status
4GB IS22ES04G 32Gbx1 3.3V x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17
8GB IS22ES08G 64Gbx1 3.3V x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17
16GB IS22ES16G 128Gbx1 3.3V x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17
32GB IS22ES32G 128Gbx2 3.3V x8 -40°C ~ 85°C 100 FBGA, 153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17
64GB IS22ES64G 128Gbx4 3.3V x8 -40°C ~ 85°C 100 FBGA,153 FBGA 5.0 153 FBGA, S=Q2/17
100 FBGA, S=2H/17

Notes:

  • Contact ISSI to request SFDP table.
  • Simulation Models not listed above may be available upon request
  • S = Sample, Prod = Production
  • NR = Not Recommended for new designs
  • EOL = End of Life
  • IF YOU DON'T SEE A PRODUCT YOU ARE INTERESTED IN AND HAVE A SPECIAL REQUEST, CONTACT US AND LET US KNOW
  • Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
  • a. the risk of injury or damage has been minimized;
  • b. the user assume all such risks; and
  • c. potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances