Integrated Silicon Solution Inc. SRAM, DRAM, FLASH, ANALOG, KGD, WAFER
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Flash

  • Single Power Supply Operation
  • Cost Effective Sector/Block Architecture
  • Low standby current 1uA (Typ)
  • Serial Peripheral Interface (SPI) Compatible
  • Page Program (up to 256 Bytes) Operation
  • Sector, Block or Chip Erase Operation
  • Low Power Consumption
  • Hardware/Software Write Protection
  • Industry Standard Pin-out and Packages
  • Superior Endurance: Min 20 years after 100K cycles

HyperFlash™

Den Part Number Type Vcc Access Time Temp.Range Package Type Status Comment
128Mb IS26KL128S HyperFlash™ 2.3-3.6V 100 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) S=NOW  
  IS26KS128S HyperFlash™ 1.7-1.95V 166 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) S=Q2/16  
256Mb IS26KL256S HyperFlash™ 2.3-3.6V 100 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) S=NOW  
  IS26KS256S HyperFlash™ 1.7-1.95V 166 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) S=NOW  
512Mb IS26KL512S HyperFlash™ 2.3-3.6V 100 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) S=NOW  
  IS26KS512S HyperFlash™ 1.7-1.95V 166 Mhz -40 to 125 deg °C 24-Ball BGA (6x8mm) S=NOW  

Serial NOR Flash (SPI)

Den Part Number Type Vcc Frequency Temp.Range Package Type Status Prev. Version/Doc
256K IS25LQ025B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IS25CD025
512K IS25LQ512B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IS25CD512
1M IS25LQ010B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IS25CD010
2M IS25LQ020B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,TSSOP,WSON,VVSOP,USON Prod IS25LD020
  IS25WQ020 Multi I/O Quad SPI 1.65-1.95V 33M/104Mhz -40 to 125°C SOIC,WSON,VVSOP, USON Prod IS25WD020
  IS25WP020 Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,TSSOP,VVSOP,WSON,USON,TFBGA S=NOW
4M IS25LQ040B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,WSON,VVSOP,USON Prod IS25LD040
  IS25WQ040 Multi I/O Quad SPI 1.65-1.95V 33M/104Mhz -40 to 125°C SOIC,WSON,VVSOP Prod IS25WD040
  IS25WP040 Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,TSSOP,VVSOP,WSON,USON,TFBGA S=NOW
8M IS25LQ080B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,WSON,VSOP Prod IS25LQ080
  IS25WP080 Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,TSSOP,VVSOP,WSON,USON,TFBGA S=NOW
  IS25WP080C Multi I/O SPI, QPI 1.65-1.95V 50M/133Mhz -40 to 85°C SOIC,VVSOP,WSON,USON S=NOW
  IS25WP080D Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON S=Q3/16
  IS25LP080D Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,VVSOP,WSON,USON S=Q3/16
16M IS25LQ016B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,WSON,VSOP Prod
IS25WP016 Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,TSSOP,VVSOP,WSON,USON,TFBGA S=NOW
  IS25WP016C Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 85°C SOIC,VVSOP,WSON,USON S=NOW
32M IS25WP032A Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA S=2H/16 IS25WP032
  IS25LP032A Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA Prod
  IS25LQ032B Multi I/O Quad SPI 2.3-3.6V 33M/104Mhz -40 to 125°C SOIC,WSON,VSOP Prod IS25CQ032
64M IS25LP064A Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA Prod IS25LP064
Application Note
  IS25WP064A Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA S=2H/16 IS25WP064
128M IS25LP128 Multi I/O SPI, QPI, DTR 2.3-3.6V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA Prod Application Note 
  IS25WP128 Multi I/O SPI, QPI, DTR 1.65-1.95V 50M/133Mhz -40 to 125°C SOIC,WSON,VSOP,TFBGA Prod
256M IS25LP256D Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA S=1H/16
  IS25WP256D Multi I/O SPI, QPI, DTR 1.65-1.95V 80M/166Mhz -40 to 125°C SOIC,WSON,TFBGA S=1H/16

Twin Serial NOR Flash (SPI)

Den Part Number Type Vcc Frequency Temp.Range Package Type Status Comment
512M IS25DLP512M Multi I/O SPI, QPI, DTR 2.3-3.6V 80M/166Mhz -40 to 125°C SOIC ,TFBGA S=1H/17  
  IS25DWP512M Multi I/O SPI, QPI, DTR 1.65-1.95V 80M/166Mhz -40 to 125°C SOIC ,TFBGA S=1H/17  

Parallel NOR Flash ISA Flash

Den Part Number Type Remark Vcc Access Time Temp.Range Package Type Status
512K IS39LV512 x8 Uniform 2.7-3.6V 70ns 0 to 85°C PLCC/VSOP Contact Factory
1M IS39LV010 x8 Uniform 2.7-3.6V 70ns 0 to 85°C PLCC/VSOP Contact Factory
4M IS39LV040 x8 Uniform 2.7-3.6V 70ns 0 to 85°C PLCC/VSOP Contact Factory
32M IS29LV032 x8/x16 Top or Bottom 2.7-3.6V 70ns -40 to 85°C TSOP,BGA Contact Factory
256M IS29GL256S x16 High or Low 2.7-3.6V 90ns -40 to 105°C TSOP,BGA Prod
512M IS29GL512S x16 High or Low 2.7-3.6V 100ns -40 to 105°C TSOP,BGA Prod
1G IS29GL01GS x16 High or Low 2.7-3.6V 100ns -40 to 105°C TSOP,BGA Prod

NAND Flash

Den Part Number Vcc Ecc Requirement Bus Width Squential Read Speed (ns) Temp.Range Package Type Status
4G IS34ML04G081 3.3V 1-bit X8 25 -40°C~85°C 48-TSOP S=NOW
4G IS34ML04G084 3.3V 4-bit X8 25 -40°C~85°C 48-TSOP S=NOW
4G IS34MW04G084 1.8V 4-bit X8 45 -40°C~85°C 48-TSOP S=NOW
4G IS34MW04G164 1.8V 4-bit X16 45 -40°C~85°C 48-TSOP Contact Factory for samples

Automotive NAND

Den Part Number Vcc Ecc Requirement Bus Width Squential Read Speed (ns) Temp.Range Package Type Status
4G IS35ML04G081 3.3V 1-bit X8 25 -40°C~85°C 48-TSOP S=NOW
4G IS35ML04G084 3.3V 4-bit X8 25 -40°C~85°C 48-TSOP S=NOW
4G IS35MW04G084 1.8V 4-bit X8 45 -40°C~85°C 48-TSOP S=NOW
4G IS35MW04G164 1.8V 4-bit X16 45 -40°C~85°C 48-TSOP Contact Factory for samples

eMMC

Den Part Number Voltage Bus Width Temperature Package Type Package Size MMC Interface Status
4GB IS21ES04G-JCLI 3.3V x8 -40°C ~ 85°C 153 ball FBGA 11.5mm x 13mm 5.0 S=Q1/17
4GB IS21ES04G-JQLI 3.3V x8 -40°C ~ 85°C 100 ball FBGA 14.0mm x 18.0mm 5.0 S=Q1/17
8GB IS21ES08G-JCLI 3.3V x8 -40°C ~ 85°C 153 ball FBGA 11.5mm x 13mm 5.0 S=Q1/17
8GB IS21ES08G-JQLI 3.3V x8 -40°C ~ 85°C 100 ball FBGA 14.0mm x 18.0mm 5.0 S=Q1/17
16GB IS21ES16G-JCLI 3.3V x8 -40°C ~ 85°C 153 ball FBGA 11.5mm x 13mm 5.0 S=Q1/17
16GB IS21ES16G-JQLI 3.3V x8 -40°C ~ 85°C 100 ball FBGA 14.0mm x 18.0mm 5.0 S=Q1/17
32GB IS21ES32G-JCLI 3.3V x8 -40°C ~ 85°C 153 ball FBGA 11.5mm x 13mm 5.0 S=Q1/17
32GB IS21ES32G-JQLI 3.3V x8 -40°C ~ 85°C 100 ball FBGA 14.0mm x 18.0mm 5.0 S=Q1/17

Automotive eMMC

Den Part Number Voltage Bus Width Temperature Package Type Package Size MMC Interface Status
4GB IS22ES04G-JCLA1 3.3V x8 -40°C ~ 85°C 153 ball FBGA 11.5mm x 13mm 5.0 S=Q1/17
4GB IS22ES04G-JQLA1 3.3V x8 -40°C ~ 85°C 100 ball FBGA 14.0mm x 18.0mm 5.0 S=Q1/17
8GB IS22ES08G-JCLA1 3.3V x8 -40°C ~ 85°C 153 ball FBGA 11.5mm x 13mm 5.0 S=Q1/17
8GB IS22ES08G-JQLA1 3.3V x8 -40°C ~ 85°C 100 ball FBGA 14.0mm x 18.0mm 5.0 S=Q1/17
16GB IS22ES16G-JCLA1 3.3V x8 -40°C ~ 85°C 153 ball FBGA 11.5mm x 13mm 5.0 S=Q1/17
16GB IS22ES16G-JQLA1 3.3V x8 -40°C ~ 85°C 100 ball FBGA 14.0mm x 18.0mm 5.0 S=Q1/17
32GB IS22ES32G-JCLA1 3.3V x8 -40°C ~ 85°C 153 ball FBGA 11.5mm x 13mm 5.0 S=Q1/17
32GB IS22ES32G-JQLA1 3.3V x8 -40°C ~ 85°C 100 ball FBGA 14.0mm x 18.0mm 5.0 S=Q1/17

FWH/ LPC Flash

Den Part Number Type Vcc Frequency Temp.Range Package Type Status Comment
4M IS49FL004T x8 3.0-3.6V 33Mhz 0 to 85°C PLCC,VSOP Prod  

Notes:

  • Contact ISSI to request SFDP table.
  • Simulation Models not listed above may be available upon request
  • S = Sample, Prod = Production
  • NR = Not Recommended for new designs
  • EOL = End of Life
  • IF YOU DON'T SEE A PRODUCT YOU ARE INTERESTED IN AND HAVE A SPECIAL REQUEST, CONTACT US AND LET US KNOW
  • Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
  • a. the risk of injury or damage has been minimized;
  • b. the user assume all such risks; and
  • c. potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances