Flash Products - Integrated Silicon Solution Inc.
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NAND Flash

  • Suited for performance-oriented applications where high reliability is needed.
  • Stores 1 bit of data per memory cell and offers fast read and write capabilities.
  • Automatic Read operations
  • Hardware Data Protection
  • Up to 100K Program/Erase Cycles
  • 10-year Data Retention
  • Supports 1-, 4-, and 8-bit ECC per 512Byte
  • Temperature Grades:
    Industrial Temp Grade: -40 to +85°C
    Extended: -40°C to +105°C
    Auto Grades: up to +105°C





SPI NAND Flash

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status
1G IS37SML01G1 x1, x2, x4 3.3V 104Mhz -40 to 105°C 16-SOIC, 8-WSON Prod
1G IS37SML01G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
1G IS37SMW01G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
2G IS37SML02G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=1H/24
2G IS37SMW02G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=1H/24
4G IS37SML04G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
4G IS37SMW04G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
8G IS37SML08G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
8G IS37SMW08G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24

Automotive SPI NAND Flash

Den Part Number Buy Type Vcc Frequency Temp.Range Package Type Status
1G IS38SML01G1 x1, x2, x4 3.3V 104Mhz -40 to 105°C 16-SOIC, 8-WSON Prod
1G IS38SML01G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
1G IS38SMW01G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
2G IS38SML02G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=1H/24
2G IS38SMW02G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=1H/24
4G IS38SML04G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
4G IS38SMW04G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
8G IS38SML08G8A x1, x2, x4 3.3V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24
8G IS38SMW08G8A x1, x2, x4 1.8V 133Mhz -40 to 105°C SOIC,WSON,TFBGA,LFBGA S=2H/24

NAND Flash

Den Part Number Buy Vcc Ecc Requirement Bus Width Sequential Read Speed (ns) Temp.Range Package Type Status
1G IS34ML01G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS34ML01G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS34MW01G084 1.8V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS34MW01G164 1.8V 4-bit X16 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS34ML02G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS34ML02G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS34MW02G084 1.8V 4-bit X8 45 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS34MW02G164 1.8V 4-bit X16 45 -40°C to 105°C 48-TSOP, 63-BGA Prod
4G IS34ML04G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP Prod
4G IS34ML04G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP Prod
4G IS34MW04G084 1.8V 4-bit X8 45 -40°C to 105°C 48-TSOP Prod
4G IS34MW04G164 1.8V 4-bit X16 45 -40°C to 105°C 48-TSOP Prod
4G IS34ML04G088/168 3.3V 8-bit X8 or X16 25 -40°C to 85°C 48-TSOP,63-BGA Prod
4G IS34MW04G088/168 1.8V 8-bit X8 or X16 25 -40°C to 85°C 48-TSOP, 63-BGA Prod
8G IS34ML08G088/168 3.3V 8-bit X8 or X16 25 -40°C to 85°C 48-TSOP, 63-BGA Prod
8G IS34MW08G088/168 1.8V 8-bit X8 or X16 25 -40°C to 85°C 48-TSOP, 63-BGA Prod

Automotive NAND Flash

Den Part Number Buy Vcc Ecc Requirement Bus Width Sequential Read Speed (ns) Temp.Range Package Type Status
1G IS35ML01G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS35ML01G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS35MW01G084 1.8V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
1G IS35MW01G164 1.8V 4-bit X16 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS35ML02G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS35ML02G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS35MW02G084 1.8V 4-bit X8 45 -40°C to 105°C 48-TSOP, 63-BGA Prod
2G IS35MW02G164 1.8V 4-bit X16 45 -40°C to 105°C 48-TSOP, 63-BGA Prod
4G IS35ML04G081 3.3V 1-bit X8 25 -40°C to 105°C 48-TSOP Prod
4G IS35ML04G084 3.3V 4-bit X8 25 -40°C to 105°C 48-TSOP Prod
4G IS35MW04G084 1.8V 4-bit X8 45 -40°C to 105°C 48-TSOP Prod
4G IS35MW04G164 1.8V 4-bit X16 45 -40°C to 105°C 48-TSOP Call Factory for Samples

Flash Application Notes

App Note Description Comment
AN25D014 Write Operation Flow for Quad SPI NOR Contact ISSI
AN29D012 Understanding and Interpreting read timing of parallel NOR FLASH Contact ISSI
AN25D011 Thin USON/WSON/XSON package handling Contact ISSI
AN25G001 Serial Peripheral Interface (SPI) Flash Layout Guide Contact ISSI
AN25G004 ISSI SPI NOR connection to Xilinx Artix-7 FPGA Contact ISSI
AN25G005 How to program ISSI flash using Xilinx iMPACT tool Contact ISSI
AN25R001 How to replace Altera EPCS/EPCQ/EPCQ-L SPI Contact ISSI
AN25R002 XIP mode conversion to ISSI SPI NOR Contact ISSI

Notes:

  • Contact ISSI to request SFDP table.
  • Simulation Models not listed above may be available upon request
  • S = Sample, Prod = Production
  • NR = Not Recommended for new designs
  • EOL = End of Life
  • IF YOU DON'T SEE A PRODUCT YOU ARE INTERESTED IN AND HAVE A SPECIAL REQUEST, CONTACT US AND LET US KNOW
  • Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
  • a. the risk of injury or damage has been minimized;
  • b. the user assume all such risks; and
  • c. potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances