Flash Products - Integrated Silicon Solution Inc.

Flash

Single Power Supply Operation
Cost Effective Sector/Block Architecture
Low standby current 1uA (Typ)
Serial Peripheral Interface (SPI) Compatible
Page Program (up to 256 Bytes) Operation
Sector, Block or Chip Erase Operation
Low Power Consumption
Hardware/Software Write Protection
Industry Standard Pin-out and Packages
Superior Endurance: Min 20 years after 100K cycles

Serial NOR Flash (QSPI, SPI)

Den	Part Number	Type	Vcc	Frequency	Temp.Range	Package Type	Status	Models	Alt. Version/Doc
512K	IS25LQ512B	Multi I/O Quad SPI	2.3-3.6V	33M/104Mhz	-40 to 125°C	SOIC,TSSOP,WSON,VVSOP,USON	Prod	IBIS/Verilog	IS25CD512
1M	IS25LP010E	Multi I/O Quad SPI	2.3-3.6V	50M/104Mhz	-40 to 125°C	SOIC,TSSOP,WSON,VVSOP,USON	Prod	IBIS/Verilog	IS25LQ010B
2M	IS25LP020E	Multi I/O Quad SPI	2.3-3.6V	50M/104Mhz	-40 to 125°C	SOIC,TSSOP,WSON,VVSOP,USON	Prod	IBIS/Verilog	IS25LQ020B
	IS25WP020E	Multi I/O Quad SPI	1.70-1.95V	50M/104Mhz	-40 to 125°C	SOIC,USON	Prod	IBIS/Verilog	IS25WD020, IS25WQ020
	IS25WP020D	Multi I/O SPI, QPI, DTR	1.65-1.95V	50M/133Mhz	-40 to 125°C	SOIC,VVSOP,WSON,USON	Prod	IBIS/Verilog
4M	IS25LP040E	Multi I/O Quad SPI	2.3-3.6V	50M/104Mhz	-40 to 125°C	SOIC,WSON,VVSOP,USON	Prod	IBIS/Verilog	IS25LQ040B
	IS25WP040E	Multi I/O Quad SPI	1.70-1.95V	50M/104Mhz	-40 to 125°C	SOIC,WSON,USON	Prod	IBIS/Verilog	IS25WD040, IS25WQ040
	IS25WP040D	Multi I/O SPI, QPI, DTR	1.65-1.95V	50M/133Mhz	-40 to 125°C	SOIC,VVSOP,WSON,USON	Prod	IBIS/Verilog
8M	IS25WP080D	Multi I/O SPI, QPI, DTR	1.65-1.95V	50M/133Mhz	-40 to 125°C	SOIC,VVSOP,WSON,USON	Prod	IBIS/Verilog	IS25WP080
	IS25LP080D	Multi I/O SPI, QPI, DTR	2.3-3.6V	50M/133Mhz	-40 to 125°C	SOIC,VVSOP,WSON,USON	Prod	IBIS/Verilog	IS25LQ080B
16M	IS25LP016D	Multi I/O SPI, QPI, DTR	2.3-3.6V	50M/133Mhz	-40 to 125°C	SOIC,VVSOP,WSON,USON,TFBGA	Prod	IBIS/Verilog	IS25LQ016B
	IS25WP016D	Multi I/O SPI, QPI, DTR	1.65-1.95V	50M/133Mhz	-40 to 125°C	SOIC,VVSOP,WSON,USON,TFBGA	Prod	IBIS/Verilog	IS25WP016
	IS25WJ016F	Multi I/O SPI, QPI, DTR	1.65-2.0V	66M/133Mhz	-40 to 105°C	SOIC,USON	Prod	IBIS/Verilog
32M	IS25LP032D	Multi I/O SPI, QPI, DTR	2.3-3.6V	50M/133Mhz	-40 to 125°C	SOIC,WSON,USON,XSON,TFBGA	Prod	IBIS/Verilog	IS25LQ032B
	IS25WP032D	Multi I/O SPI, QPI, DTR	1.65-1.95V	50M/133Mhz	-40 to 125°C	SOIC,WSON,USON,XSON,TFBGA	Prod	IBIS/Verilog	IS25WP032, IS25WP032A
	IS25WJ032F	Multi I/O SPI, QPI, DTR	1.65-2.0V	66M/133Mhz	-40 to 105°C	SOIC,USON,XSON	Prod	IBIS/Verilog
64M	IS25LP064D	Multi I/O SPI, QPI, DTR	2.3-3.6V	80M/166Mhz	-40 to 125°C	SOIC,WSON,USON,XSON,TFBGA	Prod	IBIS/Verilog	IS25LP064A
	IS25WP064D	Multi I/O SPI, QPI, DTR	1.65-1.95V	80M/166Mhz	-40 to 125°C	SOIC,WSON,USON,XSON,TFBGA	Prod	IBIS/Verilog	IS25WP064A
	IS25WJ064F	Multi I/O SPI, QPI, DTR	1.65-2.0V	66M/133Mhz	-40 to 105°C	SOIC,WSON,USON,XSON	Prod	IBIS/Verilog
128M	IS25LP128F	Multi I/O SPI, QPI, DTR	2.3-3.6V	80M/166Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod	IBIS/Verilog	IS25LP128
	IS25WP128F	Multi I/O SPI, QPI, DTR	1.65-1.95V	80M/166Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod	IBIS/Verilog	IS25WP128
	IS25WJ128F	Multi I/O SPI, QPI, DTR	1.65-2.0V	80M/166Mhz	-40 to 105°C	SOIC,WSON,USON,XSON,TFBGA	Prod	IBIS/Verilog
256M	IS25LP256D	Multi I/O SPI, QPI, DTR	2.3-3.6V	80M/166Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod	IBIS/Verilog	IS25LP256E, IS25LP256H
	IS25WP256D	Multi I/O SPI, QPI, DTR	1.7-1.95V	80M/133Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod	IBIS/Verilog	IS25WP256E
512M	IS25LP512M	Multi I/O SPI, QPI, DTR	2.3-3.6V	50M/133Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod	IBIS/Verilog	IS25LP512MG, IS25LP512MH
	IS25WP512M	Multi I/O SPI, QPI, DTR	1.7-1.95V	50M/112Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod	IBIS/Verilog	IS25WP512MG
1G	IS25LP01G	Multi I/O SPI, QPI, DTR	2.7-3.6V	50M/133Mhz	-40 to 125°C	LFBGA	Prod	IBIS/Verilog	IS25LP01GG
	IS25WP01G	Multi I/O SPI, QPI, DTR	1.7-1.95V	50M/104Mhz	-40 to 125°C	LFBGA	Prod	IBIS/Verilog	IS25WP01GG
2G	IS25LP02GG	Multi I/O SPI, QPI, DTR	2.7-3.6V	50M/133Mhz	-40 to 105°C	LFBGA	S=NOW
	IS25WP02GG	Multi I/O SPI, QPI, DTR	1.65- 1.95V	50M/133Mhz	-40 to 105°C	LFBGA	S=2H/23

Note: Contact ISSI to request SFDP table

Serial NOR Flash with ECC

Den	Part Number	Type	Vcc	Frequency	Temp.Range	Package Type	Status
128M	IS25LE128E	Multi I/O SPI, QPI, DTR	2.3-3.6V	80M/166Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Contact Factory
	IS25WE128E	Multi I/O SPI, QPI, DTR	1.7-1.95V	80M/166Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Contact Factory
256M	IS25LE256E	Multi I/O SPI, QPI, DTR	2.3-3.6V	80M/166Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod
	IS25WE256E	Multi I/O SPI, QPI, DTR	1.7-1.95V	80M/166Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod
512M	IS25LE512M	Multi I/O SPI, QPI, DTR	2.3-3.6V	50M/133Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod
	IS25WE512M	Multi I/O SPI, QPI, DTR	1.7-1.95V	50M/112Mhz	-40 to 125°C	SOIC,WSON,TFBGA	Prod
1G	IS25LE01G	Multi I/O SPI, QPI, DTR	2.7-3.6V	50M/133Mhz	-40 to 125°C	LFBGA	Prod
	IS25WE01G	Multi I/O SPI, QPI, DTR	1.7-1.95V	50M/104Mhz	-40 to 125°C	LFBGA	Prod
2G	IS25LE02GG	Multi I/O SPI, QPI, DTR	2.7-3.6V	50M/133Mhz	-40 to 105°C	LFBGA	S=NOW
	IS25WE02GG	Multi I/O SPI, QPI, DTR	1.65- 1.95V	50M/133Mhz	-40 to 105°C	LFBGA	S=2H/23

Security Flash

Den	Part Number	Buy	Type	Vcc	Frequency	Temp.Range	Package Type	Status	Alt. Version/Doc
128M	IS25RLP128F		Multi I/O SPI, QPI, DTR, RPMC	2.3-3.6V	80M/166Mhz	-40 to 85°C	WSON	Contact Factory
256M	IS25RLP256E		Multi I/O SPI, QPI, DTR, RPMC	2.3-3.6V	80M/166Mhz	-40 to 85°C	WSON	Contact Factory

Octal Flash (xSPI)

Den	Part Number	Type	Vcc	Frequency	Temp.Range	Package Type	Status	Comment/Eval Board
64M	IS25LX064	xSPI	2.7-3.6V	133Mhz	-40 to 125°C	TFBGA	Prod	Eval Board
	IS25WX064	xSPI	1.7-2.0V	200Mhz	-40 to 125°C	TFBGA	Prod	Eval Board
128M	IS25LX128	xSPI	2.7-3.6V	133Mhz	-40 to 125°C	TFBGA	Prod	Eval Board
	IS25WX128	xSPI	1.7-2.0V	200Mhz	-40 to 125°C	TFBGA	Prod	Eval Board
256M	IS25LX256	xSPI	2.7-3.6V	133Mhz	-40 to 125°C	TFBGA	Prod	Eval Board
	IS25WX256	xSPI	1.7-2.0V	200Mhz	-40 to 125°C	TFBGA	Prod	Eval Board
512M	IS25LX512M	xSPI	2.7-3.6V	133Mhz	-40 to 125°C	TFBGA	Prod	Eval Board
	IS25WX512M	xSPI	1.7-2.0V	200Mhz	-40 to 125°C	TFBGA	Prod	Eval Board
1G	IS25LX01G	xSPI	2.7-3.6V	133Mhz	-40 to 125°C	TFBGA	S=2H/23	Eval Board
	IS25WX01G	xSPI	1.7-2.0V	200Mhz	-40 to 125°C	TFBGA	S=2H/23	Eval Board
2G	IS25LX02GA	xSPI	2.7-3.6V	133Mhz	-40 to 125°C	TFBGA	Contact Factory	Eval Board
	IS25WX02GA	xSPI	1.7-2.0V	200Mhz	-40 to 125°C	TFBGA	Contact Factory	Eval Board

Twin Quad Serial NOR Flash (x8 SPI)

Den	Part Number	Type	Vcc	Frequency	Temp.Range	Package Type	Status
256M	IS25DLP256M	Multi I/O SPI, QPI, DTR	2.3-3.6V	80M/166Mhz	-40 to 125°C	SOIC,TFBGA	Contact Factory
	IS25DWP256M	Multi I/O SPI, QPI, DTR	1.65-1.95V	80M/166Mhz	-40 to 125°C	SOIC,TFBGA	Contact Factory
512M	IS25DLP512M	Multi I/O SPI, QPI, DTR	2.3-3.6V	80M/166Mhz	-40 to 125°C	SOIC,TFBGA	Prod
	IS25DWP512M	Multi I/O SPI, QPI, DTR	1.65-1.95V	80M/166Mhz	-40 to 125°C	SOIC ,TFBGA	Contact Factory

HyperFlash™

Den	Part Number	Buy	Type	Vcc	Frequency	Temp.Range	Package Type	Status	Comment
128/256Mb	IS26KS/KL Family		HyperFlash™	-	-	-	-	Contact Factory

Parallel (ISA) NOR Flash

Den	Part Number	Type	Remark	Vcc	Access Time	Temp.Range	Package Type	Status
32M	IS29GL032	x8/x16	Top Boot (U) or Bottom Boot (D) High Protection (T) or Low Protection (B)	2.7-3.6V	70ns	-40 to 125°C	TSOP,BGA	Prod
64M	IS29GL064	x8/x16	Top Boot (U) or Bottom Boot (D) High Protection (T) or Low Protection (B)	2.7-3.6V	70ns	-40 to 125°C	TSOP,BGA	Prod
128M	IS29GL128	x8/x16	High Protection (T) or Low Protection (B)	2.7-3.6V	70ns	-40 to 125°C	TSOP,BGA	Prod
256M	IS29GL256	x8/x16	High Protection (T) or Low Protection (B)	2.7-3.6V	70ns	-40 to 125°C	TSOP,BGA	Prod

SPI NAND Flash

Den	Part Number	Type	Vcc	Frequency	Temp.Range	Package Type	Status
1G	IS37SML01G1	x1, x2, x4	3.3V	104Mhz	-40 to 105°C	16-SOIC, 8-WSON	Prod
1G	IS37SML01G8A	x1, x2, x4	3.3V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
1G	IS37SMW01G8A	x1, x2, x4	1.8V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
2G	IS37SML02G8A	x1, x2, x4	3.3V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=1H/24
2G	IS37SMW02G8A	x1, x2, x4	1.8V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=1H/24
4G	IS37SML04G8A	x1, x2, x4	3.3V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
4G	IS37SMW04G8A	x1, x2, x4	1.8V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
8G	IS37SML08G8A	x1, x2, x4	3.3V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
8G	IS37SMW08G8A	x1, x2, x4	1.8V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24

Automotive SPI NAND Flash

Den	Part Number	Type	Vcc	Frequency	Temp.Range	Package Type	Status
1G	IS38SML01G1	x1, x2, x4	3.3V	104Mhz	-40 to 105°C	16-SOIC, 8-WSON	Prod
1G	IS38SML01G8A	x1, x2, x4	3.3V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
1G	IS38SMW01G8A	x1, x2, x4	1.8V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
2G	IS38SML02G8A	x1, x2, x4	3.3V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=1H/24
2G	IS38SMW02G8A	x1, x2, x4	1.8V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=1H/24
4G	IS38SML04G8A	x1, x2, x4	3.3V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
4G	IS38SMW04G8A	x1, x2, x4	1.8V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
8G	IS38SML08G8A	x1, x2, x4	3.3V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24
8G	IS38SMW08G8A	x1, x2, x4	1.8V	133Mhz	-40 to 105°C	SOIC,WSON,TFBGA,LFBGA	S=2H/24

NAND Flash

Den	Part Number	Vcc	Ecc Requirement	Bus Width	Sequential Read Speed (ns)	Temp.Range	Package Type	Status
1G	IS34ML01G081	3.3V	1-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
1G	IS34ML01G084	3.3V	4-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
1G	IS34MW01G084	1.8V	4-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
1G	IS34MW01G164	1.8V	4-bit	X16	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
2G	IS34ML02G081	3.3V	1-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
2G	IS34ML02G084	3.3V	4-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
2G	IS34MW02G084	1.8V	4-bit	X8	45	-40°C to 105°C	48-TSOP, 63-BGA	Prod
2G	IS34MW02G164	1.8V	4-bit	X16	45	-40°C to 105°C	48-TSOP, 63-BGA	Prod
4G	IS34ML04G081	3.3V	1-bit	X8	25	-40°C to 105°C	48-TSOP	Prod
4G	IS34ML04G084	3.3V	4-bit	X8	25	-40°C to 105°C	48-TSOP	Prod
4G	IS34MW04G084	1.8V	4-bit	X8	45	-40°C to 105°C	48-TSOP	Prod
4G	IS34MW04G164	1.8V	4-bit	X16	45	-40°C to 105°C	48-TSOP	Prod
4G	IS34ML04G088/168	3.3V	8-bit	X8 or X16	25	-40°C to 85°C	48-TSOP,63-BGA	Prod
4G	IS34MW04G088/168	1.8V	8-bit	X8 or X16	25	-40°C to 85°C	48-TSOP, 63-BGA	Prod
8G	IS34ML08G088/168	3.3V	8-bit	X8 or X16	25	-40°C to 85°C	48-TSOP, 63-BGA	Prod
8G	IS34MW08G088/168	1.8V	8-bit	X8 or X16	25	-40°C to 85°C	48-TSOP, 63-BGA	Prod

Automotive NAND

Den	Part Number	Vcc	Ecc Requirement	Bus Width	Sequential Read Speed (ns)	Temp.Range	Package Type	Status
1G	IS35ML01G081	3.3V	1-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
1G	IS35ML01G084	3.3V	4-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
1G	IS35MW01G084	1.8V	4-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
1G	IS35MW01G164	1.8V	4-bit	X16	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
2G	IS35ML02G081	3.3V	1-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
2G	IS35ML02G084	3.3V	4-bit	X8	25	-40°C to 105°C	48-TSOP, 63-BGA	Prod
2G	IS35MW02G084	1.8V	4-bit	X8	45	-40°C to 105°C	48-TSOP, 63-BGA	Prod
2G	IS35MW02G164	1.8V	4-bit	X16	45	-40°C to 105°C	48-TSOP, 63-BGA	Prod
4G	IS35ML04G081	3.3V	1-bit	X8	25	-40°C to 105°C	48-TSOP	Prod
4G	IS35ML04G084	3.3V	4-bit	X8	25	-40°C to 105°C	48-TSOP	Prod
4G	IS35MW04G084	1.8V	4-bit	X8	45	-40°C to 105°C	48-TSOP	Prod
4G	IS35MW04G164	1.8V	4-bit	X16	45	-40°C to 105°C	48-TSOP	Call Factory for Samples

eMMC

Den	Part Number	Bus Width	Temperature	Package Type	MMC Interface	Status	Alt. Version/Doc
8GB	IS21ES08GA	x8	-40°C ~ 85°C	100 FBGA, 153 FBGA	5.0	Prod	IS21ES08G
16GB	IS21TF16G	x8	-40°C ~ 85°C	100 FBGA, 153 FBGA	5.1	Prod	IS21ES16G
32GB	IS21TF32G	x8	-40°C ~ 85°C	100 FBGA, 153 FBGA	5.1	Prod	IS21ES32G
64GB	IS21TF64G	x8	-40°C ~ 85°C	100 FBGA,153 FBGA	5.1	Prod	IS21ES64G
128GB	IS21TF128G	x8	-40°C ~ 85°C	100 FBGA,153 FBGA	5.1	Prod

Automotive eMMC

Den	Part Number	Bus Width	Temperature	Package Type	MMC Interface	Status	Alt. Version/Doc
8GB	IS22TF08G	x8	-40°C ~ 105°C	100 FBGA, 153 FBGA	5.1	Prod	IS22ES08G
16GB	IS22TF16G	x8	-40°C ~ 105°C	100 FBGA, 153 FBGA	5.1	Prod	IS22ES16G
32GB	IS22TF32G	x8	-40°C ~ 105°C	100 FBGA, 153 FBGA	5.1	Prod	IS22ES32G
64GB	IS22TF64G	x8	-40°C ~ 105°C	100 FBGA,153 FBGA	5.1	Prod	IS22ES64G
128GB	IS22TF128G	x8	-40°C ~ 105°C	100 FBGA,153 FBGA	5.1	Prod

UFS 2.1

Den	Part Number	VCC/VCCQ	Temperature	Package Type	UFS Interface	Status
64GB	IS27TH064G21	3.3V/1.8V	-40°C ~ 105°C	153 FBGA	UFS 2.1	Sampling
128GB	IS27TH128G21	3.3V/1.8V	-40°C ~ 105°C	153 FBGA	UFS 2.1	Sampling
256GB	IS27TH256G21	3.3V/1.8V	-40°C ~ 105°C	153 FBGA	UFS 2.1	Sampling

UFS 3.1

Den	Part Number	VCC/VCCQ	Temperature	Package Type	UFS Interface	Status
64GB	IS27TH064G31	2.5V/1.2V	-40°C ~ 105°C	153 FBGA	UFS 3.1	S=Q1/24
128GB	IS27TH128G31	2.5V/1.2V	-40°C ~ 105°C	153 FBGA	UFS 3.1	S=Q1/24
256GB	IS27TH256G31	2.5V/1.2V	-40°C ~ 105°C	153 FBGA	UFS 3.1	S=Q1/24

Flash Application Notes

App Note	Description	Comment
AN25D014	Write Operation Flow for Quad SPI NOR	Contact ISSI
AN29D012	Understanding and Interpreting read timing of parallel NOR FLASH	Contact ISSI
AN25D011	Thin USON/WSON/XSON package handling	Contact ISSI
AN25G001	Serial Peripheral Interface (SPI) Flash Layout Guide	Contact ISSI
AN25G004	ISSI SPI NOR connection to Xilinx Artix-7 FPGA	Contact ISSI
AN25G005	How to program ISSI flash using Xilinx iMPACT tool	Contact ISSI
AN25R001	How to replace Altera EPCS/EPCQ/EPCQ-L SPI	Contact ISSI
AN25R002	XIP mode conversion to ISSI SPI NOR	Contact ISSI

Notes:

Contact ISSI to request SFDP table.
Simulation Models not listed above may be available upon request
S = Sample, Prod = Production
NR = Not Recommended for new designs
EOL = End of Life
IF YOU DON'T SEE A PRODUCT YOU ARE INTERESTED IN AND HAVE A SPECIAL REQUEST, CONTACT US AND LET US KNOW
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:

a. the risk of injury or damage has been minimized;
b. the user assume all such risks; and
c. potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances

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Serial NOR Flash (QSPI, SPI)

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HyperFlash™

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Automotive SPI NAND Flash

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Automotive NAND

eMMC

Automotive eMMC

UFS 2.1

UFS 3.1

Flash Application Notes

Notes: